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September 14, 2026Communications MaterialsOpen Access

Proton-transfer-mediated interfacial electronic engineering for molecular assembly

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Authors

QLQing Wei LiWWWen Jing WangXLXue Feng Liu

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Overview

Experimental study reveals pH-driven proton transfer optimizes organosilane film assembly on copper, indicating an eco-friendly path for anti-corrosion surface engineering.

Key Points

  • To elucidate how solution pH regulates interfacial electronic structures and molecular bonding strength through proton-transfer processes at metal-organic interfaces.
  • Assembled aminopropyltrimethoxysilane corrosion-protection films onto copper substrates across varying solution pH conditions.
  • Conducted surface characterization and theoretical calculations to evaluate molecular energy gaps, electron transfer, and interfacial coordination.
  • Films prepared under weakly alkaline conditions (pH 9) demonstrated a low-frequency impedance modulus of 1.77×10^6 Ω·cm2 and an anti-corrosion protection efficiency exceeding 99%.
  • Alkaline conditions triggered ionization of silanol groups (Si-O-) and enhanced electron transfer, enabling non-protonated amino groups to form strong N-Cu coordination bonds with a binding energy of 131.4 kJ/mol.
  • Acidic conditions caused amino group protonation (-NH3+), broadening the energy gap and diminishing molecular electron-donating capability, which severely impaired interfacial bonding.

Cite This Study

Li et al. (2026) studied this question.

synapsesocial.com/papers/6aa7b3d00926e14a848b313fhttps://doi.org/10.1038/s43246-026-01362-z
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