Thiol versus Selenol SAMs as Nucleation Enhancers and Adhesion Promoters for Plasma Polymerized Pyrrole on Copper Substrates

The use of SAMs to enhance the deposition and growth of polypyrrole (PPy) thin films on a copper substrate by plasma‐enhanced chemical vapor deposition (PECVD) is described. The composition, ordering, and compactness of the monolayers is studied by XPS, PM‐IRRAS, and electrochemical techniques in order to determine their quality. Pyrrole plasma polymerization is carried out on SAMs and on bare copper to study the effect of the monolayer in the deposition process. AFM microscopy demonstrates that, because of the pyrrole‐terminated group, PPy nuclei deposit and grow preferably on the SAM‐modified surface. The PPy films deposited on SAMs show very good adhesion to a copper substrate, which makes them good candidates for new electronic components. magnified image