Three‐dimensional simulation of microchip encapsulation process

A finite element simulation of moving boundaries in a three‐dimensional inertiafree, incompressible flow is presented. A control volume scheme with a fixed finite element mesh is employed to predict fluid front advancement. Fluid front advancement and pressure variation in a flow domain similar to the mold cavity used for microchip encapsulation are predicted. The predicted fluid front advancement and pressure variation are in good agreement with the corresponding experimental results. As the difference in the thicknesses of mold cavities above and below the microchip is changed, the weld line location and pressure variation during mold filling are found to change significantly.