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A novel solution-stamping process for the preparation of a highly conductive aluminum thin film on both rigid and flexible substrates is proposed. The superior electrical properties of Al thin films fabricated by the solution-stamping process compared to silver and gold films fabricated from colloidal nanoparticles are experimentally demonstrated, and their applications in electronic circuits on rigid and flexible substrates and to organic light-emitting diodes (OLEDs) are investigated.
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Lee et al. (2011) studied this question.
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