Role of polymer chain end groups in plasma modification for surface metallization of polymeric materials

How to improve adhesion between poly(oxybenzoate‐co‐oxynaphthoate) (Vecstar OC and FA films) and copper metal by Ar, O2, N2 and NH3 plasma modification was investigated. The mechanism of adhesion improvement is discussed from the viewpoint of chemical and physical interactions at the interface between the Vecstar film and copper metal layer. The adhesion between Vecstar OC film and copper metal was improved by chemical rather than physical interactions. Polymer chain end groups that occur at Vecstar OC film surfaces contribute effectively to adhesion. This improvement in adhesion is due to interactions between copper metal and OC groups formed by plasma modification. Aggregation of the OC groups to the copper metal/Vecstar OC film interface is a key factor for good adhesion. From this aspect, heat treatment of plasma‐modified Vecstar OC films on glass plates is effective in the aggregation, and the peel strength for the copper metal/Vecstar OC film system reached 1.21 N (5 mm)−1.