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December 1, 1990Journal of Electronic Packaging

Mechanical Behavior of Flip-Chip Encapsulants

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Authors

ESE. SuhirPortland State UniversityJSJ.M. SegelkenAT&T (United States)

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Suhir et al. (1990) studied this question.

synapsesocial.com/papers/6aa9254a398b99bbe68cb49bhttps://doi.org/10.1115/1.2904385
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