Cobalt has emerged as a potential adhesion layer for advanced copper metallization. This work investigates the role of oxidant and inhibitor on the corrosion and polishing properties of cobalt in the acid slurry. It is found that H 2 O 2 could greatly increase the static etch rate (SER) and removal rate (RR) of cobalt. The 2-Mercaptothiazoline (2-MT) is very efficient to inhibit cobalt corrosion and reduce the SER and RR of cobalt in the acid slurry. In the glycine based slurry at pH = 5, by using 2-MT, the corrosion potential difference between Co and Cu can be reduced to a very small value.
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Lu et al. (2012) studied this question.
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