Phase formation and surface hardening in the 100-nm-thick Al(film)/Ti(substrate) system under conditions of pulsed electron-beam melting (∼15 keV, ∼3 μs, 3–4 J/cm 2 ) have been studied depending on the number of film deposition-melting cycles. Using this method, submicrocrystalline and nanocrystalline surface alloys with thicknesses ≥3 μm based on Ti 3 Al and TiAl intermetallics have been obtained on the titanium substrate.
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Ротштейн et al. (2011) studied this question.
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