Intentionally implemented scribing failures in Cu(In,Ga)Se2 modules are studied using electroluminescence (EL) and dark lock‐in thermography (DLIT). While the EL images do not allow a non‐ambiguous defect distinction, the DLIT images reveal characteristic defect patterns for each defect type. In order to explain the DLIT defect appearance, we model and simulate the scribing defects in a network simulation model. The simulations yield characteristic current flow patterns for each scribing defect type and thus aid in the understanding and interpretation of the measurements.
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Misic et al. (2015) studied this question.
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