The kinetics of electrochemical copper deposition from copper sulfate‐sulfuric acid solutions have been studied by measuring polarization curves with a rotating‐disk electrode. Kinetics models are evaluated and their parameters determined by nonlinear regression analysis of 87 data points. The data are fit within experimental error by a five‐parameter model which includes the effects of both copper sulfate and sulfuric acid concentrations. The statistical analysis is made feasible by the rapid simulation of the experimental system by orthogonal collocation. The simulation involves computation of current distribution below limiting current at a specified applied potential for a given kinetics model.
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Cabán et al. (1977) studied this question.