Residual Stresses in a Wo‐Phase Microcracking Ceramic

Residual stresses in a SiC‐TiB 2 particulate composite before and after stressing have been measured using X‐ray diffraction. Tensile residual stresses in the TiB 2 drop by 60% after bending stresses of 250 MPa are applied. Likewise, the compressive residual stresses in the Sic phase decrease accordingly. Such behavior is consistent with stress‐induced microcracking.