Direct metallization of nickel on polymeric template patterns for fabrication of copper circuits on glass substrates

We demonstrate a chemical route to depositing nickel granular layer patterns using ion-doped precursor templates, which can be used as adhesive interlayers for fabrication of copper circuit patterns on glass substrates. The poly(amic acid) templates were first dispensed from solution onto the glass surface using a fine-precision dispenser, followed by Ni2+ ion doping through selective ion exchange reaction. The reduction treatment using aqueous NaBH4 solution allowed the formation of a nickel granular layer on the poly(amic acid) surface, which could catalyze subsequent electrodeposition of copper. The resulting copper/nickel/polyimide-layered structure showed good adhesion with the glass substrate. This work can benefit the understanding of the growth process of metallic thin films via the direct metallization process and provide important experimental data for developing novel fabrication processes for copper circuit patterns on glass substrates.