In-situ tensile analysis of microstructure evolution in Ni, Ni5W, and Ni9W using EBSD

This study systematically investigates the deformation behavior of Ni, Ni5W, and Ni9W alloys during tensile testing accompanied by electron backscatter diffraction (EBSD) analysis. During the plastic deformation stage, the loss of EBSD signals at grain boundaries is significantly influenced by the direction of tensile loading. Grain boundaries perpendicular to the tensile direction are prone to strain localization but do not typically result in the loss of EBSD signals. In contrast, grain boundaries parallel to the tensile direction frequently show EBSD signal loss. Further analysis indicates that, with increasing deformation, the grain behavior in Ni, Ni5W, and Ni9W samples diverges into two main trends: one trend involves grains rotating towards a low Schmid factor orientation, which effectively resists dislocation slip and results in the formation of specific texture; the other trend maintains a high Schmid factor orientation, aligns with dislocation slip, and leads to texture evolution. In summary, this study enhances the understanding of the tensile deformation in face-centered cubic (FCC) metals, providing a theoretical foundation for optimizing the mechanical properties of metallic materials.