Synapse
⌘+K
Synapse
PulseExploreClubsResearchersJournals
Instagram
HomeClubsExplore
January 1, 2018Journal of The Electrochemical SocietyOpen Access

In Situ Study of Mechanical-Electrochemical Interactions during Cobalt ECMP

View Full Paper
Ask AI
Bookmark
Share

Authors

WXWenhu XuJiangxi Normal UniversityLMLian MaNantong UniversityYCYan ChenHebei Medical University

Discussion

Loading...

Member takes

Implication

Key Points

Key points are not available for this paper at this time.

Cite This Study

Xu et al. (2018) studied this question.

synapsesocial.com/papers/6aaca50ac7e070df51ecbcddhttps://doi.org/10.1149/2.0661805jes
View Full Paper
Ask AI
Bookmark
Share

Also Consider

Synapse has enriched 5 closely related papers on similar clinical questions. Consider them for comparative context:

  1. 1Chemical Mechanical Polishing of Chemical Vapor Deposited Co Films with Minimal Corrosion in the Cu/Co/Mn/SiCOH Patterned Structures2017 · 49 citations
  2. 2Atomic Layer Deposited Co(W) Film as a Single-Layered Barrier/Liner for Next-Generation Cu-Interconnects2012 · 29 citations
  3. 3Mechanism of Co Liner as Enhancement Layer for Cu Interconnect Gap-Fill2013 · 111 citations
  4. 4Effect of Electric Potential and Mechanical Force on Copper Electro-Chemical Mechanical Planarization2012 · 3 citations
  5. 5Effect of Cu-Ion Concentration in Concentrated H[sub 3]PO[sub 4] Electrolyte on Cu Electrochemical Mechanical Planarization2010 · 11 citations