Sr Ti O 3 (STO) thin films were deposited at 370°C by atomic layer deposition using H2O as the oxidant, and Ti(O–iPr)2(thd)2 and Sr(thd)2 as Ti, and Sr precursors, respectively. Denser STO films were produced at this deposition temperature. The saturated growth rate was 0.15Å∕cycle. The adoption of a thin crystallized seed layer resulted in crystallized perovskite STO films at the as-deposited state without higher temperature post-annealing. A tox of 0.72nm (dielectric constant of 108) and a low leakage current density (∼10−7A∕cm2 at 0.8V) were obtained from a planar capacitor structure consisting of Pt∕20-nm-thick STO/Ru (bottom).
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Lee et al. (2008) studied this question.
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