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January 1, 2018Journal of Materials Chemistry C

A low temperature and air-sinterable copper–diamine complex-based metal organic decomposition ink for printed electronics

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Abstract

A Cu–diamine formulated ink for obtaining flexible conductive Cu films in an air atmosphere at temperatures as low as 130 °C.

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Cite This Study

Dong et al. (2018) studied this question.

synapsesocial.com/papers/6aae2316f4925908d1d2e839 https://doi.org/10.1039/c8tc01849a

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