Enhanced thermal property and anti-moisture absorption of PA6/P (N-(4-carboxyphenyl)maleimide-alt-triallyl isocyanurate) composites based on solid-state interfacial reaction

In order to expand its application range in electronics and membrane industries, this paper aimed to develop polyamide 6 (PA6)/P (N-(4-carboxyphenyl) maleimide-alt-triallyl isocyanurate) (PCT) composites with heat-resisting, thermally conductive and anti-moisture, by employing PCT as a reactive reinforcement material and applying irradiation for solid-state interfacial reaction (SSIR) between PCT and PA6. According to the results, the SSIR occurred between PA6 and PCT. Compared with non-SSIR PA6, the PA6/PCT composite with SSIR showed the highest heat resistance, thermal conductivity and anti-moisture absorption and its relative crystallinity (Xc), glass transition temperature (Tg), and heat deflection temperature (HDT), thermal conductivity and anti-moisture absorption were improved by 61.4, 24.0, 83.9, 18.5 and 40.2%, respectively. This is because that the chemical bond between the PCT surface and the PA6 matrix is formed by SSIR, which provides a theoretical basis either for the development of PA6 or other semi-crystalline polymers.