Light weight and flexible poly(ether ether ketone) based composite film with excellent thermal stability and mechanical properties for wide-band electromagnetic interference shielding

degradation temperature at 5% mass loss of 586 °C) and good mechanical properties (tensile strength of 101 MPa), being superior to other previously reported EMI shielding films. The above mentioned enhanced property demonstrated its potential application as a high performance EMI shield for certain applications such as in the aerospace, weapons, and microelectronics industries, which require materials exhibits EMI shielding as well as superior mechanical properties and thermal stability.