The effects of various transition-metal dopants on the electrical and thermal transport properties of Fe_1-xMₓSi alloys (M $=$ Co, Ir, Os) are reported. The maximum thermoelectric figure of merit Z{T}ₘₐₓ$ is improved from 0.007 at 60 K for pure FeSi to $ZT$ $=$ 0.08 at 100 K for 4% Ir doping. A comparison of the thermal conductivity data among Os-, Ir-, and Co-doped alloys indicates strong electron-phonon coupling in this compound. Because of this interaction, the common approximation of dividing the total thermal conductivity into independent electronic and lattice components ({κ}ₜₒₜₐₗ $=$ {κ}electronic $+$ {κ}lattice) fails for these alloys. The effects of grain size on thermoelectric properties of Fe0.96Ir0.04Si alloys are also reported. The thermal conductivity can be lowered by {~}50% with little or no effect on the electrical resistivity or Seebeck coefficient. This results in Z{T}ₘₐₓ$ $=$ 0.125 at 100 K, still approximately a factor of 5 too low for solid-state refrigeration applications.
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Sales et al. (2011) studied this question.
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