The flake core–shell Cu‐Ag powders are prepared and characterized. Isotropic conductive adhesives (ICAs) filled with flake silver‐coated copper was prepared by using epoxide resin as matrix and tetraethylenepentamine as curing agent. The flake silver‐coated copper was characterized by scanning electron microscopy, X‐ray diffraction, energy dispersive X‐ray spectroscopy, and TG‐DTA. The results show Ag content in the surface of coated copper is up to 96.32%. Oxidation resistance of flake Cu‐Ag powders with high surface Ag content is improved greatly investigated by TG‐DTA. And bulk resistivity and shear strength of ICAs are measured. It was found that the percolation threshold of ICAs filled with flake Cu‐Ag powders is as low as 40 wt%. The ICAs have good overall performances. And the main influence factor on electric resistivity was analyzed. POLYM. COMPOS., 38:846–851, 2017.
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