Durability of Wood Flour-Thermoplastic Composites under Extreme Environmental Conditions and Fungal Exposure

The main purpose of this research work was to investigate the response of wood flour reinforced polyethylene composites to 2 hours water boiling, five complete boiling and freezing cycles and fungal (Gloeophyllumm Traebum/Brown-rot fungus) exposure. Five composite formulations were manufactured and analyzed (0, 50, 60, 70 and copper carbonate treated 60% wood flour/polyethylene composites). The results showed that wood flour loading decreased the resistance of the composites to moisture and fungal environment. The exposure of the composites to 2 hours water boiling and five complete boiling and freezing cycles caused serious damage to the interfacial adhesion between wood flour and polyethylene matrix due to contraction and swelling stresses developed during cyclic exposure. The addition of 1 percent copper carbonate salt during compounding of wood flour and polyethylene prevented the colonization and proliferation of fungus on the surface of the composites, but had a negative effect on the water uptake and flexural properties of the composites.