The control of airborne molecular contamination (AMC) plays an increasing role in semiconductor manufacturing processes. We conducted a parametric study of purging a front-opening unified pod (FOUP), a wafer box for handling 300 mm wafers, with nitrogen experimentally, analytically and numerically. Factor considered to affect purging include the coefficient of absorption and desorption of water vapor through the FOUP's polycarbonate material, the configuration of plenum injector, the best composition of plenum injector and the FOUP, and the selection on purge flow rate. This study clarified purge phenomena.
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Hu et al. (2006) studied this question.
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