A hybrid integration technology has been developed which only involves the use of InP components. A six-channel multi-wavelength laser has been realised using this approach. The chips were bonded using a UV-curable epoxy and packaged in a commercial laser module. A 1.6 GHz 3 dB bandwidth and a linewidth of < 1 MHz were measured.
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Thourhout et al. (2000) studied this question.
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