High-performance composite Ag-Ni mesh based flexible transparent conductive film as multifunctional devices

Conventional fabrication methods for realization of metal mesh (MM) based transparent conductive film (TCF) are not economic and environmentally friendly. By combination of the scrape and selective electroplating techniques, a vacuum sputtering/evaporation-free process is explored for fabrication of high-performance MM based TCF. The fabricated TCF exhibits ultra-low sheet electrical resistance (Rs = 0.07 Ω sq-1) at average transmittance of 83% in visible region. The sample cannot only exhibit high heating temperatures (140 °C) at low input voltage (1.5 V) with fast and stable thermal response but provide high electromagnetic interference shielding efficiency (EMI SE) more than 43 dB in X-band. The processing chain provides a robust, powerful and scalable platform, which may open up a new avenue for realizing multifunctional TCF in diverse applications.