Origin of the Bismuth-Induced Decohesion of Nickel and Copper Grain Boundaries

Ductile metals such as Ni and Cu can become brittle when certain impurities (e.g., Bi) diffuse and segregate into their grain boundaries (GBs). Using first-principles calculations, we investigate the microscopic origin of the Bi-induced loss of cohesion of Ni and Cu GBs. We find that the Bi bilayer interfacial phase is the most stable impurity phase under the Bi-rich condition, while the Bi monolayer phase is a metastable phase regardless of the value of the Bi chemical potential. Our finding is consistent with the recent experimental observation for Ni GBs [Luo et al. Science 333, 1730 (2011)]. The electric polarization effect of the Bi bilayer substantially enhances the strength of the Bi-metal interfacial bonds, stabilizing the bilayer phase over other phases. The Bi-Bi interlayer bonding is significantly weakened in the GBs, leading to a factor of 20 to 50 decrease in the GB cohesion, which has strong implications for the understanding of Bi-induced intergranular fracture of Ni and Cu polycrystals.