Low-temperature-resilient, lightweight long-range communication module

In cold environments, such as polar regions, high altitudes, and space, wireless communication devices suffer from performance degradation or functional failure due to low-temperature conditions. The housing material can become brittle, leading to structural failures and instability in electrical parameters. To address these challenges, we present a low-temperature-adaptive, lightweight module with a size of 1,300 × 80 × 10 mm and a weight of 500 g. Through thermal management design and material selection, the module delivers adaptability to low temperatures and communication capability. Operating at −80°C, the module is over 43% lighter than comparable commercial modules and extends the maximum communication range (200 km) by 50%–100%. Long-term durability testing showed that after 30 days of continuous operation at −80°C, the module maintained stable startup and operation.