Polyamidoamine (PAMAM) dendrimers were investigated as curing agents in bisphenol A epoxy resin systems. The cure behavior of epoxy resin/PAMAM at varying components was investigated by a dynamic torsional vibration method (DTVM); the thermal behavior of the materials was characterized by means of thermogravimetric (TGA) analyses. The DTVM results show that 10/100 parts of the resin (phr) PAMAM was the optimum concentration for 1.0, 3.0, and 5.0 G PAMAM dendrimers/resin systems in our experiment. Also, the TGA results agreed with the conclusions made by the DTVM.
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Cheng et al. (2006) studied this question.
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