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Spectroscopic ellipsometry (SE) has been used to investigate etching characteristics of (111) and (100)Si surfaces in aqueous KOH solution. A linear regression analysis and an effective medium approximation indicate that when a native SiO x (SiO2) layer is partly etch-removed, the resulting surface is very rough. Just after the SiO x layer is etched away completely, the SE data yield the spectrum of a nearly flat Si surface. The order of the degree of roughness is found to be (100)Si>(111)Si. It is also shown that surface roughening can be greatly suppressed with magnetic stirring.
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Adachi et al. (1993) studied this question.
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