Using the NO2adsorption and Al2O3passivation technique, we improved the thermal stability of hydrogen-terminated diamond field-effect transistors (FETs) and then demonstrated stable operation at 200 °C in a vacuum for the first time. At 200 °C, the drain current IDSof a passivated diamond FET remained constant for at least more than 2 h. No degradation of FET characteristics was observed after the 200 °C heating cycle. Furthermore, a passivated diamond FET with a gate length of 0.2 μm showed high maximum IDSof -1000 mA/mm and an RF output power density of 2 W/mm.
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Hirama et al. (2012) studied this question.
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