Fabrication and characterization of fine pitch on-chip copper interconnects for advanced wafer level packaging by a high aspect ratio through AZ9260 resist electroplating

Fabrication and characterization of fine pitch on-chip copper interconnects for advanced wafer level packaging by a high aspect ratio through AZ9260 resist electroplating, Dixit, Pradeep, Tan, Chee Wee, Xu, Luhua, Lin, Nay, Miao, Jianmin, Pang, John H L, Backus, Petra, Preisser, Robert