The time and temperature dependence of hydrogen permeation through silicon oxide into polycrystalline silicon was examined. The presence of an oxide layer causes the H flux into the underlying polycrystalline silicon (poly-Si) to decrease by more than 4 orders of magnitude compared to poly-Si without an oxide layer. For oxides thicker than 0.1 {μ}m the H flux is independent of the hydrogenation time. On the other hand, a direct exposure of poly-Si to monatomic H exhibits a power-law decrease in H flux with time. Without the presence of an oxide layer the H flux exhibits a weak temperature dependence and is activated with EA=0.31 eV. The activation energy does not change significantly when diffusing through an oxide, indicating that an increase in barrier height cannot account for the striking decrease in H flux. The implications of these results for H diffusion are discussed.
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Nickel et al. (1995) studied this question.
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