Kinetics of boron reactivation in doped silicon from Hall effect and spreading resistance techniques

In this work, a series of 13 boron implants were performed into Czochralski silicon substrates with doses of 2×1014–1.6×1015 cm−2 at energies of 10–80 keV. The boron was deliberately clustered with a 750 °C anneal of 10 or 30 min and the electrical activation of the boron implants was determined following a second anneal at 750 or 850 °C with a Hall effect system with certain samples also being analyzed with a spreading resistance technique. Analysis of the reactivation rates allows for the determination of the net energy to boron reactivation to be approximately 3.0 eV assuming the reactivation process is mediated by release of a boron interstitial with a migrational energy of 0.3 eV. This results in a critical binding energy of approximately 2.7 eV from the process limiting the dissolution of the most stable boron-interstitial cluster.