A 0.5-mm-thick cadmium telluride (CdTe) semiconductor pixel sensor with 1024 pixels has been bump-bonded onto a two-dimensional (2-D) single photon counting pixel read out chip (MPEC 2.1) using a special gold-stud technique. The pixel size is 200 /spl times/ 200 /spl mu/m/sup 2/, the active area is 6.4 /spl times/ 6.4 mm/sup 2/. The successful operation of this high-Z imaging pixel device is demonstrated. Noise and threshold dispersion as well as the imaging performance are reported.
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Fischer et al. (2001) studied this question.
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