The thermal conduction of a solid/liquid porphoritic heat sink material having a specific geometry is reported. This new material consists of submicron-size diamond particles dispersed in n-decane at high packing fractions. Although each constituent has a measured decrease in thermal conduction with increasing temperature, the thermal conduction of the mixture shows a unique and significant increase with increasing temperature. This novel increase in thermal conduction has particular relevance to the thermal management of die that have uneven heat dissipation requirements. The material also has particular application in the construction and thermal design of multichip modules (MCM's).
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R.G.C. Artus (1996) studied this question.