Numerical Simulation of Laser Ablation with Short and Ultra-short Pulses for Metals and Semiconductors

Laser ablation is widely used for micro-fabrication in electronic industry and multi-physical numerical simulations allow a better understanding of such processes and can be used to predict the ablation conditions. The recent use of short and ultra-short pulses discloses a new scope of applications. In order to simulate the new conditions arising when using short as well as ultra-short pulses a complex model comprising the physics of laser assisted manufacturing was employed. The model has been extended by means of a two-temperature model that enables the coupling of electron- and lattice-temperature, which is considered essential to describe such short time-scale phenomena, since electrons and lattice of the workpiece are not in thermal equilibrium during the pulse. A comparison of simulation results with available experimental data is finally provided for the case of metals and semiconductors.