Jet plating is a high‐speed electroplating technique. Due to its special flow characteristics it can be used to localize the electrodeposition reaction on an unmasked cathode. In this process, a jet of plating solution is directed to a cathode surface, and electroplating is done by applying an electric field between the cathode and an anode located in the jet nozzle. The electric current travels along the jet stream to the cathode, and electrodeposition reaction takes places locally only on the area where the jet impinges on the cathode surface. The objective of this study is to find the metal thickness distribution on the cathode surface as a function of current density, electrolyte composition, electrolyte velocity, and nozzle height. Copper plating from an acidic copper sulfate bath and nickel plating from a Watts nickel bath and a nickel sulfamate bath were studied.
No takes yet. Share an insight, caveat, or question.
Karakuş et al. (1994) studied this question.
Synapse has enriched 5 related papers. Consider them for comparative context: