Design and testing of novel piezoceramic modules for adaptive thermoplastic composite structures

For the series production of adaptive fibre-reinforced thermoplastic structures, the development of process-adapted piezoceramic modules is gaining central importance. Therefore, thermoplastic-compatible piezoceramic modules (TPMs) are being developed which are suitable for a matrix-homogeneous adhesive-free integration of the modules in fibre-reinforced thermoplastic structures during a sequential hot-pressing process. Extensive numerical and experimental studies are available on the systematic development of the TPMs, whose thermoplastic carrier film, made, respectively, of polyetheretherketone (PEEK) or polyamide (PA), is already adapted to the matrix material of a thermoplastic composite structure and thus can be joined in a welding process without additional adhesives. The studies carried out indicate the influence of geometrical and technological parameters on the efficiency of consolidated and polarized TPMs and can thus be used to adapt the design specifications and process parameters of the TPMs. Besides these studies, a numerically based residual stress analysis shows the potential for a defined inducing of residual stresses in the TPM components.