The grain size distribution of copper and nickel processed by severe plastic deformation was studied by transmission electron microscopy. The temperature dependence of electrical resistivity in the temperature range from 20 to 300 K is presented. The tunnel model of electrical resistivity of grain boundaries is discussed. The width of the potential barrier at grain boundaries in copper and nickel is determined. Larger values of potential barriers are noted in ultrafine grained materials in comparison to the crystallographic width of grain boundaries.
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Islamgaliev et al. (1997) studied this question.
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