Rapid laser excitation of semiconductor heterojunctions produces localized temperature gradients, carrier accumulation, and interfacial stresses that can impair device performance and reliability. This study develops a two-dimensional photo-thermoelastic model to determine how mechanical, thermal, and electronic interface imperfections control coupled wave transmission across a GaAs/ Al 0.3 Ga 0.7 As heterojunction. Its main contribution is the simultaneous treatment of finite normal and tangential stiffnesses, Kapitza thermal resistance, band-dependent carrier partition, limited carrier transfer, and interfacial recombination. For surface-absorbing or optically coated devices with negligible penetration depth, the laser is represented by prescribed heat and photocarrier fluxes at the illuminated boundary without volumetric generation. Generalized thermoelasticity, dual-phase-lag heat conduction, and carrier diffusion are coupled in each semiconductor. Helmholtz decomposition and normal-mode analysis identify the thermal, carrier, longitudinal, and shear modes. Reducing normalized interface stiffness from 10 to 0.1 decreases peak normal stress by approximately 48% and increases displacement discontinuity. Increasing normalized Kapitza resistance from zero to one creates a temperature jump of approximately 0.09. Reducing carrier transfer from 10 to 0.1 decreases transmitted carrier density by about 45%, while stronger recombination reduces interfacial carrier density by approximately 50%. The model provides a unified framework for evaluating laser-induced responses in optoelectronic and thermal-management devices under operating conditions.
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Alshehri et al. (2026) studied this question.
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