TiN single-layer and TiN/Rh bilayer coatings were deposited on titanium substrates by magnetron sputtering to investigate the effect of TiN interlayer sputtering power on the structural and scratch adhesion behavior of TiN/Rh coatings, with potential relevance to coated components used in spacecraft locking and releasing mechanisms. The influence of TiN sputtering power (50–150 W) on the microstructure, surface morphology, and scratch adhesion behavior was systematically investigated. For TiN single-layer coatings, increasing sputtering power improved crystallinity, grain size, and densification, while the critical scratch load increased from 23 N to 49 N. For TiN/Rh coatings, the critical scratch load increased from 23 N to 60 N. Scratch morphology observations showed a transition from brittle spallation at lower sputtering power to predominantly cohesive failure at 150 W, indicating improved resistance to progressive coating failure. TEM observations of the coating prepared at 150 W revealed a well-defined bilayer structure, a continuous TiN/Rh interface without obvious interfacial defects, and a well-crystallized FCC Rh phase. The results indicate that increasing TiN sputtering power increases the TiN deposition rate and layer thickness, while also improving the structural quality of the TiN interlayer. The resulting TiN layer provides more favorable structural conditions for subsequent Rh growth. This work provides an experimental basis for optimizing TiN interlayer deposition and improving adhesion of TiN/Rh coatings.
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Zhang et al. (2026) studied this question.
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