Assembling Isostructural Metal‐Organic Coordination Architectures on Cu(100), Ag(100) and Ag(111) Substrates

Isostructural coordination architectures in two dimensions on different substrates require sufficient metal-organic bonding strength to overcome templating effects from the surface. The network structure in this STM image was grown on Cu(100) and was also produced on Ag(111) and Ag(100) surfaces, due to robust three-fold NCu coordination interactions stabilizing the network.