The performance of single wall carbon nanotube field effect transistors (SWNT FETs) is greatly affected by the quality of its contacts. The presence of Schottky barriers imposes a strong scaling of the gate dielectric thickness. Here, we employ large diameter SWNTs in order to fabricate ohmically contacted FETs when a lower work function but higher adhesion strength metal such as Cr is used. A subthreshold slope as low as 113 mV/dec is obtained even when employing a thick, 200 nm SiO₂dielectric. The result is examined in light of the positive effects of exposure to air and underlines the possibility for less stringent device fabrication techniques.
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Pisana et al. (2008) studied this question.
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