Strain‐Insensitive Conductors for Stretchable Electronics

Stretchable electronics are rapidly evolving from simple planar configurations to complex, three‐dimensional (3D) multifunctional architectures. However, traditional stretchable conductors frequently suffer from severe resistance fluctuations under mechanical deformation. To address this challenge, this review systematically summarizes two core design paradigms for achieving robust strain insensitivity. The first paradigm, corresponding to structurally strain‐insensitive conductors, relies on a top–down geometric decoupling strategy that physically dissipates strain through 3D buckling or kirigami structures. The second paradigm, corresponding to intrinsically strain‐insensitive conductors, employs a bottom–up network reconstruction strategy that leverages the fluidic adaptability of liquid metals or the dynamic sliding of nanofillers to sustain continuous percolation networks under stress. Beyond these fundamental paradigms, we comprehensively evaluate precise fabrication processes and critical system‐level integration challenges, with a particular focus on in‐plane modulus mismatch and Z ‐axis interlayer shear failure. Importantly, this review highlights the indispensable role of strain‐insensitive conductors in advanced applications, demonstrating their unique capability to eliminate motion artifacts in bioelectronics, lock resonant frequencies in wireless communications, and ensure thermal safety in high‐power actuation platforms. Finally, we outline future trajectories for large‐scale industrial manufacturing and long‐term in vivo stability, aiming to accelerate the commercialization of technologies within this interdisciplinary field.