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In this paper, we describe the development of a miniature surface acoustic wave (SAW) duplexer for Band I in the standard of the Third-Generation Partnership Project (3GPP) at a 2 GHz band. We employed a shear-horizontal SAW on a SiO 2 overlay/thick Al electrode/5°YX-LiNbO 3 structure, which offers a high electromechanical coupling coefficient ( K 2 ) as well as a small temperature coefficient of frequency (TCF). This feature is crucial for the realization of a wide duplex gap between the transmitting and receiving bands in the Band I specification. We investigated experimentally that the spurious response caused by the Rayleigh-mode could effectively be suppressed by controlling the cross-sectional shape of a SiO 2 overlay on interdigital transducer (IDT) electrodes. In addition, the result also showed how this spurious response depends on IDT design parameters, i.e., electrode pitch and metallization ratio. The developed SAW duplexer was installed in a 2.5 × 2.0 mm 2 package, and exhibited a low insertion loss, a high out-of-band rejection and a small TCF.
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Nakamura et al. (2008) studied this question.
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