Stick–Slip Adhesion and Peel-Front Dynamics

This paper proposes a structured experimental roadmap within the Adhesion–Triboelectric–Corona–Maillard (ATCM) framework to characterise stick-slip rupture, peel-front velocity, fibril bridge formation, and snap-back behaviour. Grounded in pressure-sensitive adhesive (PSA) analogues and advanced peel mechanics, Module A2 defines the dynamic conditions under which triboelectric amplification becomes possible, providing essential mechanical context for downstream module T3. Utilizing high-speed imaging and controlled peel testing protocols, the roadmap establishes falsifiable benchmarks for transient debonding phenomena. This paper proposes a structured experimental roadmap rather than reporting experimental results.