Deformation‐Robust Multimodal Electronic Skin Enabled by Conformal Surface Plasmons for Cross‐Medium Robotic Perception

Electronic skins (e‐skins) generally transduce contact mechanics but cannot interrogate materials concealed by packaging, limiting robotic perception to accessible surfaces. A multimodal cross‐medium e‐skin is developed by co‐designing a five‐channel piezoresistive network and a conformal surface‐plasmon (CSP) waveguide within a shared flexible interdigitated‐electrode architecture. The piezoresistive channel maps grasp pressure over 0–140 kPa with response and recovery times below 50 ms, whereas the CSP channel confines microwaves to a subwavelength near field for phase‐based pre‐touch sensing and frequency‐resolved electromagnetic fingerprinting. Strong field localization preserves transmission fingerprints under bending and twisting up to 80° and enables interrogation through glass, plastic, and paper containers. Coupled with a support vector machine, these fingerprints discriminate 16 sample classes with 99.4% test accuracy and 99.7% leave‐one‐out cross‐validation accuracy. When integrated with a dexterous robotic hand, the platform unifies grasp‐pressure mapping, proximity perception, and nondestructive recognition of hidden contents. This shared‐architecture strategy transforms conformal plasmonic waveguides into deformation‐tolerant functional sensing interfaces and extends e‐skin beyond contact‐limited tactile sensing toward cross‐medium robotic perception.