Oxide semiconductors are promising channel materials for ultrathin electronics. However, conventional growth methods often produce excess carriers, poor stability, and interfacial issues, limiting their electronic applications. Here, we present a layered precursor‐guided synthesis of atom‐thin amorphous indium oxide (In 2 O 3 ) by oxidizing a layered InSe precursor within a back‐end‐of‐line (BEOL)‐compatible thermal budget. The oxide thickness is precisely controlled by the number of precursor layers, enabling In 2 O 3 as thin as 0.63 nm at the physical thickness limit. By avoiding localized nucleation and island coalescence issues, the resulting In 2 O 3 exhibits atomically smooth surfaces and excellent electrostatic uniformity with potential variations below 22 meV. Capacitance‐voltage analyses confirm a carrier density of 2.8 × 10 18 cm −3 in the nondegenerate regime and a low interface trap density of 10 10 ∼10 11 cm −2 ·eV −1 . We further demonstrate reproducible enhancement‐mode transistors with sub‐3 nm channels, featuring near‐zero threshold voltage, a low subthreshold swing (SS) of ∼74 mV/dec, a negligible hysteresis of < 10 mV, and robust gate‐stress stability. This work establishes a reliable route for integrating ultrathin, high‐performance amorphous oxide semiconductors, pushing the limits of next‐generation nanoelectronics.
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Shen et al. (2026) studied this question.
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