Through-chip microchannels with enhanced performance and safety for thermal management in multilayer electronics

Thermal management remains one of the most formidable challenges in designing multi-layer high-power-density chips. Recently, through-chip microchannels (TCMCs) with coolant flowing perpendicular to the layers achieved heat fluxes of several kW.cm −2 , the highest among current chip-cooling technologies. However, the original TCMCs present risks of infiltration and corrosion that could compromise the chip’s integrity. To address these issues, we apply a coating layer to the microchannel surfaces that acts as a safety barrier between the water flow and the electronic components. Our simulations show that adjusting this layer’s thickness and surface roughness optimizes cooling performance, enabling heat fluxes beyond 20 kW.cm −2 . We also verified that the safety layer remains stable under shear forces induced by water flow in the microchannels, ensuring long-term functionality. These results highlight the potential of TCMCs to address thermal management issues for next-generation multilayer 3D integrated circuits and high-power electronic devices.