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Solution‐processed two‐dimensional (2D) films are key functional components in flexible and multifunctional electronic systems. However, most coating and transfer strategies rely on passive planar interfaces, limiting conformal contact and film uniformity on geometrically complex substrates. This review discusses conformal coating and transfer of 2D nanomaterials through dynamic interface engineering. Representative 2D nanomaterials, including graphene, transition metal dichalcogenides, hexagonal boron nitride, black phosphorus, MXenes, and metal‐based nanosheets, are examined to identify the material parameters governing coating behavior, including aspect ratio, bending rigidity, surface chemistry, and interfacial adhesion. Conventional strategies, including mechanical dry transfer, wet transfer, direct solution coating, and interface‐mediated film formation, are reviewed, showing that passive interfacial evolution fundamentally limits conformal integration on curved and three‐dimensional substrates. Dynamic interface engineering strategies based on acoustic, electric, and magnetic fields actively regulate nanosheet transport and interfacial contact during film formation. Ultrasonic cavitation‐driven assembly and metal‐ion release assembly demonstrate that direction‐independent driving mechanisms enable geometry‐adaptive conformal coating. Remaining challenges in operando characterization, scalable manufacturing, and predictive modeling are discussed. This review proposes dynamic interface engineering as a general framework for designing conformal coating strategies for next‐generation three‐dimensional electronic systems.
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Kim et al. (2026) studied this question.
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