Epitaxial growth of yttrium-stabilized HfO2 high-k gate dielectric thin films on Si

Epitaxial yttrium-stabilized HfO2 thin films were deposited on p-type (100) Si substrates by pulsed laser deposition at a relatively lower substrate temperature of 550 °C. Transmission electron microscopy observation revealed a fixed orientation relationship between the epitaxial film and Si; that is, (100)Si//(100)HfO2 and 001Si//001HfO2. The film/Si interface is not atomically flat, suggesting possible interfacial reaction and diffusion. X-ray photoelectron spectrum analysis also revealed the interfacial reaction and diffusion evidenced by Hf silicate and Hf–Si bond formation at the interface. The epitaxial growth of the yttrium stabilized HfO2 thin film on bare Si is via a direct growth mechanism without involving the reaction between Hf atoms and SiO2 layer. High-frequency capacitance–voltage measurement on an as-grown 40-Å yttrium-stabilized HfO2 epitaxial film yielded an effective dielectric constant of about 14 and equivalent oxide thickness to SiO2 of 12 Å. The leakage current density is 7.0×10−2 A/cm2 at 1 V gate bias voltage.